REOLOSIL provides thickening and thixotropy effects in liquid systems such as polyesters, epoxies, and urethane resins resins due to interactions between aggregaes and the development of three-dimensional networks between REOLOSIL particles.

Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL’s large specific surface area also makes it possible to ahieve excellent transparency in elastomers.

REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing fillers.

Due to a property that makes it behave like ball bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems.

REOLOSIL is added to film resins to reduce “stcking.” It reduces close contact between film layers.

Gaseous, liquid or solid materials can be precipitated or adsorbed on the surface of REOLOSIL. This serves as an ideal carrier or substrate for active ingredients due to its high specific surface area and inertness in the presence of all chemicals except strong alkalis and hydrofluoric acid.

With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation propertes.

Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications.

In the semiconductor manufacturing process, the planarization of silicon wafers is achieved via CMP(chemical mechanical polishing) processes such as ILD,STI and metal CMP. REOLOSIL is used in certain CMP slurries as polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

Grade of Reolosil
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